Realme has announced the impending release of its new smartphone, Realme Neo7 SE, slated for launch next month. The company touts the device as the “Dimensity 8400-Ultra machine”, promising superior performance and extended battery life.
This announcement follows MediaTek’s recent debut of the Dimensity 8400 processor on December 23, 2024.
The chip is the first to feature the Cortex-A725 full-core architecture, delivering a 10% boost in single-core performance and reducing power consumption by 35%. It boasts eight A725 CPU cores and an Arm Immortalis G720 MC7 GPU running at 1.3GHz, which supports hardware ray tracing and offers 24% improved peak GPU performance while consuming 42% less power than its predecessor.
Realme also launched the Dimensity 8400 Endurance Ares co-creation plan, further showcasing its partnership with MediaTek.
The Realme Neo7, released last month, featured the Dimensity 9300+ processor, a 7000mAh battery, and 80W fast charging. It included a 50MP Sony IMX882 main camera with anti-shake functionality, a 6000nit BOE customized flexible screen with a resolution of 2780×1264, and a starting price of 2099 yuan.
With the Neo7 SE, Realme aims to deliver even more cutting-edge performance and efficiency, leveraging the capabilities of MediaTek’s Dimensity 8400 chip.
